Interposer and method for manufacturing same

ABSTRACT

An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a bottom surface and a top surface, and defines a receiving through hole extending through the bottom surface and the top surface. The photosensitive dielectric film is mounted on the bottom surface. The photosensitive dielectric film defines a through hole spatially corresponding to and communicating with the receiving through hole. The conductive layer is mounted on an end of the photosensitive dielectric film away from the insulating substrate. The conductive layer covers an end of the through hole. 
     The conductive via is received in the receiving through hole and the through hole. The conductive via contacts and electrically connects to the conductive layer.

BACKGROUND

1. Technical Field

The present disclosure relates to an interposer and a method formanufacturing the interposer.

2. Description of Related Art

Manufacturing processes of interposers includes forming a seed layer ina receiving through hole of an insulating substrate. However, theprocess is complex and time-consuming. Furthermore, the seed layergenerates thermal stress on the interposer.

Therefore, what is needed is an interposer and a method formanufacturing the interposer that can overcome the above-mentionedlimitations.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood withreference to the following drawings. The components in the drawings arenot necessarily drawn to scale, the emphasis instead being placed uponclearly illustrating the principles of the present embodiments.Moreover, in the drawings, all the views are schematic, and likereference numerals designate corresponding parts throughout the severalviews.

FIG. 1 is a schematic, cross-sectional view of an embodiment of aninterposer.

FIG. 2 is a flowchart of an embodiment of a method for manufacturing theinterposer of FIG. 1.

FIGS. 3-7 are views showing successive stages of the method formanufacturing the interposer of FIG. 1.

DETAILED DESCRIPTION

FIG. 1 shows an embodiment of an interpose plate 10. The interpose plate10 includes an insulating substrate 11, a photosensitive dielectric film12, a conductive layer 13, and a conductive via 14.

The insulating substrate 11 includes a bottom surface 10 a and a topsurface 10 b. The bottom surface 10 a is substantially parallel to thetop surface 10 b. In one embodiment, the insulating substrate 11 is madeof glass. The insulating substrate 11 defines a receiving through hole110 extending through the bottom surface 10 a and the top surface 10 b.

The photosensitive dielectric film 12 is mounted on the bottom surface10 a. In one embodiment, the photosensitive dielectric film 12 is madeof photosensitive polyimides. The photosensitive dielectric film 12includes a supporting surface 121 contacting the bottom surface 10 a anda lower surface 122 facing away from the bottom surface 10 a. Thephotosensitive dielectric film 12 defines a through hole 120 spatiallycorresponding to and communicating with the receiving through hole 110.

The conductive layer 13 is mounted on the lower surface 122 of thephotosensitive dielectric film 12, and covers an end of the through hole120. The conductive layer 13 can be made of, but is not limited to,copper, silver, or gold.

In one embodiment, the conductive via 14 is an electroplated copperlayer formed in the receiving through hole 110 and the through hole 120by an electroplating method. The conductive via 14 contacts andelectrically connects to the conductive layer 13.

Unlike conventional interposers, the interposer 100 omits a seed layerin the receiving through hole 110. Therefore, the conductive via 14 isformed directly in the receiving through hole 110 without the seedlayer, which prevents generation of thermo-mechanical stress betweencopper and sidewall of the through hole 110. Consequently, reliabilitycan be improved.

FIG. 2 is a flowchart of a method for manufacturing the interposer 100.The method is as follows and illustrated in FIGS. 3-7.

FIG. 3 shows that in step 1, an assembling plate 20 is provided. Theassembling plate 20 includes a supporting sheet 21, an adhesive film 22laminated on the supporting sheet 21, a conductive layer 13 laminated onthe adhesive film 22, and a photosensitive dielectric film 12 laminatedon the conductive layer 13. The photosensitive dielectric film 12includes a lower surface 122 contacting the conductive layer 13 and asupporting surface 121.

FIG. 4 shows that in step 2, an insulative layer 11 is provided. Theinsulative layer 11 includes a bottom surface 10 a and a top surface 10b. A receiving through hole 110 is defined in the insulative layer 11 byan electric laser ablation method.

FIG. 5 shows that in step 3, the insulative layer 11 is assembled ontothe supporting surface 121, such that the supporting surface 121 coversone end of the receiving through hole 110.

FIG. 6 shows that in step 4, light is irradiated onto the supportingsurface 121 of the photosensitive dielectric film 12 to expose thephotosensitive dielectric film 12 and define a through hole 120 in thedielectric film 12. The through hole 120 communicates with the receivingthrough hole 110. In one embodiment, the light is ultraviolet light.

FIG. 7 shows that in step 5, a conductive via 14 is formed on theconductive layer 13 by an electroplating method. The conductive via 14is further formed in the receiving through hole 110 and the through hole120 and electrically connected to the conductive layer 13.

Finally, the adhesive film 22 and the supporting sheet 21 are removed toobtain the interposer 10.

Unlike conventional method, using the photosensitive dielectric film 12with the conductive layer 13, the adhesive film 22 and the supportingsheet 21, the process becomes simple, for example, sputtering for seedlayer can be removed. Therefore, process cost reduction might beachieved.

While certain embodiments have been described and exemplified above,various other embodiments will be apparent from the foregoing disclosureto those skilled in the art. The disclosure is not limited to theparticular embodiments described and exemplified but is capable ofconsiderable variation and modification without departure from the scopeand spirit of the appended claims.

What is claimed is:
 1. An interposer, comprising: an insulatingsubstrate comprising a bottom surface and a top surface, and defining areceiving through hole extending through the bottom surface and the topsurface; a photosensitive dielectric film mounted on the bottom surface,the photosensitive dielectric film defining a through hole spatiallycorresponding to and communicating with the receiving through hole; aconductive layer mounted on an end of the photosensitive dielectric filmaway from the insulating substrate, the conductive layer covering an endof the through hole; and a conductive via received in the receivingthrough hole and the through hole, the conductive via contacting andelectrically connecting to the conductive layer.
 2. The interposer ofclaim 1, wherein the insulating substrate is made of a glass.
 3. Theinterposer of claim 1, wherein the photosensitive dielectric filmcomprises a supporting surface contacting the bottom surface and a lowersurface, the through hole penetrating through the supporting surface andthe bottom surface.
 4. The interposer of claim 1, wherein the conductivevia is an electroplated copper layer.
 5. A method for manufacturing aninterposer, comprising: providing an assembling plate, the assemblingplate comprising a supporting sheet, an adhesive film laminated on thesupporting sheet, a conductive layer laminated on the adhesive film, anda photosensitive dielectric film laminated on the conductive layer;providing an insulative layer, the insulative layer defining a receivingthrough hole; assembling the insulative layer onto the photosensitivedielectric film, the photosensitive dielectric film covering an endportion of the receiving through hole; irradiating the photosensitivedielectric film to expose the photosensitive dielectric film by usinglight, so as to define a through hole in the photosensitive dielectricfilm, the through hole communicating with the receiving through hole;forming a conductive via on the conductive layer in the receivingthrough hole and the through hole, the conductive via electricallyconnected to the conductive layer; and removing the adhesive film andthe supporting sheet, so as to obtain the interposer.
 6. The method ofclaim 5, wherein the insulative layer defines the receiving through holeby an electric laser ablation process.
 7. The method of claim 5, whereinthe conductive via are formed on the conductive layer by anelectroplating process.
 8. The method of claim 5, wherein the light isultraviolet light.
 9. The method of claim 5, wherein the insulatingsubstrate is made of glass.
 10. The method of claim 5, wherein thephotosensitive dielectric film comprises a supporting surface contactingwith the bottom surface and a lower surface facing away from the bottomsurface, the through hole penetrates through the supporting surface andthe lower surface.